TY - GEN
T1 - Low-cost temperature-compensated thermoresistive micro calorimetric flow sensor by using 0.35μm CMOS MEMS technology
AU - Xu, Wei
AU - Gao, Bo
AU - Ma, Shenhui
AU - Zhang, Anping
AU - Chiu, Yi
AU - Lee, Yi Kuen
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/2/26
Y1 - 2016/2/26
N2 - In this paper, a low-cost Temperature-compensated Thermoresistive Micro Calorimetric Flow (T2MCF) sensor by using a commercial 0.35μm 2P4M CMOS MEMS technology is reported. For nitrogen flow, the fabricated T2MCF sensor achieves a normalized sensitivity of 230 mV/(m/s)/mW with respect to the input heating power, which is two orders of magnitude better than the reported micro calorimetric flow sensors. The experimental results of T2MCF sensor under different ambient temperatures Ta of 22°C∼48°C showed the excellent temperature insensitive output with the maximum normalized variation of 0.5%. Compared to the uncompensated counterpart (49%), it demonstrates our robust T2MCF sensor design is applicable for the integration of on-chip CMOS electronics for the Internet of Things.
AB - In this paper, a low-cost Temperature-compensated Thermoresistive Micro Calorimetric Flow (T2MCF) sensor by using a commercial 0.35μm 2P4M CMOS MEMS technology is reported. For nitrogen flow, the fabricated T2MCF sensor achieves a normalized sensitivity of 230 mV/(m/s)/mW with respect to the input heating power, which is two orders of magnitude better than the reported micro calorimetric flow sensors. The experimental results of T2MCF sensor under different ambient temperatures Ta of 22°C∼48°C showed the excellent temperature insensitive output with the maximum normalized variation of 0.5%. Compared to the uncompensated counterpart (49%), it demonstrates our robust T2MCF sensor design is applicable for the integration of on-chip CMOS electronics for the Internet of Things.
UR - http://www.scopus.com/inward/record.url?scp=84970990488&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2016.7421590
DO - 10.1109/MEMSYS.2016.7421590
M3 - Conference contribution
AN - SCOPUS:84970990488
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 189
EP - 192
BT - MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Y2 - 24 January 2016 through 28 January 2016
ER -