Localized sealing schemes for MEMS packaging

Yu-Ting Cheng^*, Y. C. Su, Liwei Lin

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

Original language	English
Title of host publication	Mems Packaging
Publisher	World Scientific Publishing Co. Pte Ltd
Pages	223-249
Number of pages	27
ISBN (Electronic)	9789813229365
ISBN (Print)	9789813229358
DOIs	https://doi.org/10.1142/9789813229365_0011
State	Published - 3 Jan 2018

Access to Document

@inbook{3bc5c1f9fcbc418792c4e45638a8b60a,

title = "Localized sealing schemes for MEMS packaging",

author = "Yu-Ting Cheng and Su, {Y. C.} and Liwei Lin",

year = "2018",

month = jan,

day = "3",

doi = "10.1142/9789813229365_0011",

language = "English",

isbn = "9789813229358",

pages = "223--249",

booktitle = "Mems Packaging",

publisher = "World Scientific Publishing Co. Pte Ltd",

address = "Singapore",

}

TY - CHAP

T1 - Localized sealing schemes for MEMS packaging

AU - Cheng, Yu-Ting

AU - Su, Y. C.

AU - Lin, Liwei

PY - 2018/1/3

Y1 - 2018/1/3

UR - http://www.scopus.com/inward/record.url?scp=85045086947&partnerID=8YFLogxK

U2 - 10.1142/9789813229365_0011

DO - 10.1142/9789813229365_0011

M3 - Chapter

AN - SCOPUS:85045086947

SN - 9789813229358

SP - 223

EP - 249

BT - Mems Packaging

PB - World Scientific Publishing Co. Pte Ltd

ER -