Life period estimation of stamping process using punch sounds and deep neural network

Peng Jen Chen; Tsung Lun Wu; Tay Jyi Lin; Ying Hui Lai; Tsung Liang Wu; Chingwei Yeh

doi:10.1109/ICIEA.2019.8833634

Life period estimation of stamping process using punch sounds and deep neural network

Peng Jen Chen, Tsung Lun Wu, Tay Jyi Lin, Ying Hui Lai, Tsung Liang Wu, Chingwei Yeh

Department of Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

This paper presents the life period estimation of stamping process by analyzing its punch sounds with a deep neural network (DNN). Neuro-approximated MFCC (NA-MFCC) feature extraction has also been proposed to trade estimation accuracy for computation complexity at a finer granularity. Several Pareto-optimal configurations have been reported with the performance measured on an ARM Cortex A15-based prototype.

Original language	English
Title of host publication	Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	625-628
Number of pages	4
ISBN (Electronic)	9781538694909
DOIs	https://doi.org/10.1109/ICIEA.2019.8833634
State	Published - Jun 2019
Event	14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019 - Xi'an, China Duration: 19 Jun 2019 → 21 Jun 2019

Publication series

Name	Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019

Conference

Conference	14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019
Country/Territory	China
City	Xi'an
Period	19/06/19 → 21/06/19

Access to Document

10.1109/ICIEA.2019.8833634

Cite this

Chen, P. J., Wu, T. L., Lin, T. J., Lai, Y. H., Wu, T. L., & Yeh, C. (2019). Life period estimation of stamping process using punch sounds and deep neural network. In Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019 (pp. 625-628). Article 8833634 (Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICIEA.2019.8833634

Chen, Peng Jen ; Wu, Tsung Lun ; Lin, Tay Jyi et al. / Life period estimation of stamping process using punch sounds and deep neural network. Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 625-628 (Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019).

@inproceedings{87e9fe212f314681a7e891571efdbc6a,

title = "Life period estimation of stamping process using punch sounds and deep neural network",

abstract = "This paper presents the life period estimation of stamping process by analyzing its punch sounds with a deep neural network (DNN). Neuro-approximated MFCC (NA-MFCC) feature extraction has also been proposed to trade estimation accuracy for computation complexity at a finer granularity. Several Pareto-optimal configurations have been reported with the performance measured on an ARM Cortex A15-based prototype.",

author = "Chen, {Peng Jen} and Wu, {Tsung Lun} and Lin, {Tay Jyi} and Lai, {Ying Hui} and Wu, {Tsung Liang} and Chingwei Yeh",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019 ; Conference date: 19-06-2019 Through 21-06-2019",

year = "2019",

month = jun,

doi = "10.1109/ICIEA.2019.8833634",

language = "English",

series = "Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "625--628",

booktitle = "Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019",

address = "美國",

}

Chen, PJ, Wu, TL, Lin, TJ, Lai, YH, Wu, TL & Yeh, C 2019, Life period estimation of stamping process using punch sounds and deep neural network. in Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019., 8833634, Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019, Institute of Electrical and Electronics Engineers Inc., pp. 625-628, 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019, Xi'an, China, 19/06/19. https://doi.org/10.1109/ICIEA.2019.8833634

Life period estimation of stamping process using punch sounds and deep neural network. / Chen, Peng Jen; Wu, Tsung Lun; Lin, Tay Jyi et al.
Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 625-628 8833634 (Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Life period estimation of stamping process using punch sounds and deep neural network

AU - Chen, Peng Jen

AU - Wu, Tsung Lun

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AU - Yeh, Chingwei

PY - 2019/6

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AB - This paper presents the life period estimation of stamping process by analyzing its punch sounds with a deep neural network (DNN). Neuro-approximated MFCC (NA-MFCC) feature extraction has also been proposed to trade estimation accuracy for computation complexity at a finer granularity. Several Pareto-optimal configurations have been reported with the performance measured on an ARM Cortex A15-based prototype.

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M3 - Conference contribution

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T3 - Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019

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BT - Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019

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Chen PJ, Wu TL, Lin TJ, Lai YH, Wu TL, Yeh C. Life period estimation of stamping process using punch sounds and deep neural network. In Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 625-628. 8833634. (Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019). doi: 10.1109/ICIEA.2019.8833634

Life period estimation of stamping process using punch sounds and deep neural network

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