Layout design on multi-finger MOSFET for on-chip ESD protection circuits in a 0.18-μm salicided CMOS process

Ming-Dou Ker*, Che Hao Chuang, Wen Yu Lo

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    18 Scopus citations

    Abstract

    The layout design to improve uniform ESD current distribution in multi-finger MOSFET devices for better ESD robustness is investigated in a 0.18-μm salicided CMOS process. The multi-finger MOSFET, without adding the pick-up guard ring inserted into its source region, or with the vertical direction of power line connection, can sustain a higher ESD level. The layout of I/O cell can be drawn more compactly, but still to provide deep-submicron CMOS IC's with higher ESD robustness.

    Original languageEnglish
    Title of host publicationICECS 2001 - 8th IEEE International Conference on Electronics, Circuits and Systems
    Pages361-364
    Number of pages4
    DOIs
    StatePublished - 1 Dec 2001
    Event8th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2001 - , Malta
    Duration: 2 Sep 20015 Sep 2001

    Publication series

    NameProceedings of the IEEE International Conference on Electronics, Circuits, and Systems
    Volume1

    Conference

    Conference8th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2001
    Country/TerritoryMalta
    Period2/09/015/09/01

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