Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

Keyphrases

• Simulation Techniques 100%
• Interposer 100%
• Through Glass via 100%
• Glass Interposer 100%
• Layout Dependences 100%
• Submodeling 100%
• Factorial Design Method 100%
• Epoxy Molding Compound 66%
• System Integration 33%
• Low Power Consumption 33%
• Sidewall 33%
• Finite Element Analysis 33%
• Silicon-based 33%
• Fabrication Cost 33%
• Deactivation 33%
• Promising Solutions 33%
• Analytic Results 33%
• Stress Generation 33%
• Analysis Architecture 33%
• Stress Magnitude 33%
• Process-oriented 33%
• Analysis of Variance Method 33%
• Stress Simulation 33%
• Chiplet 33%
• Sub-model Method 33%
• First Principal Stress 33%
• Multi-chiplet 33%
• Thermo-mechanical Response 33%
• Element Activation 33%
• Scale Mismatch 33%
• High-density System 33%
• Structural Design Parameters 33%
• Three-level Full Factorial Design 33%

Engineering

• Simulation Technique 100%
• Interposer 100%
• Stress Dependence 100%
• Glass Interposer 100%
• Sheet Molding Compounds 66%
• Low Power Consumption 33%
• Side Wall 33%
• Design Parameter 33%
• Integrated Information System 33%
• Structural Design 33%
• Full Factorial Design 33%
• Finite Element Analysis 33%

Material Science

• Sheet Molding Compounds 100%
• Factorial Design 100%
• Density 50%
• Silicon 50%
• Finite Element Method 50%