Large-Swing-Tolerant ESD Protection circuit for gigahertz power amplifier in a 65-nm CMOS Process

Chun Yu Lin*, Shiang Yu Tsai, Li Wei Chu, Ming-Dou Ker

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    3 Scopus citations

    Abstract

    The signal swing at output pad of some radio-frequency (RF) power amplifiers (PAs) may be higher than the supply voltage. To protect the gigahertz large-swing power amplifier from electrostatic discharge (ESD) damage in nanoscale CMOS process, a large-swing-tolerant ESD protection circuit is presented in this paper. The proposed ESD protection circuit had been designed, fabricated, and characterized in a 65-nm CMOS process, where it can achieve low parasitic capacitance, large swing tolerance, high ESD robustness, and good latchup immunity. The proposed ESD protection circuit had been further applied to a 2.4-GHz PA to provide 3-kV human-body-model (HBM) ESD robustness without degrading the RF performances.

    Original languageEnglish
    Article number6381493
    Pages (from-to)914-921
    Number of pages8
    JournalIEEE Transactions on Microwave Theory and Techniques
    Volume61
    Issue number2
    DOIs
    StatePublished - 1 Jan 2013

    Keywords

    • Electrostatic discharge (ESD)
    • power amplifier (PA)
    • radio-frequency (RF)
    • silicon-controlled rectifier (SCR)

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