Abstract
We have improved the Q-factor of a 4.6 nH spiral inductor, fabricated on a standard Si substrate, by more than 60%, by using an optimized proton implantation process. The inductor was fabricated in a 1-poly-6-metal process, and Implanted after processing. The implantation increased the substrate impedance by ∼ one order of magnitude without disturbing the inductor value before resonance. The S-parameters were well described by an equivalent circuit model. The significantly improved inductor performance and VLSI-compatible process makes the proton implantation suitable for high performance RF ICs.
Original language | English |
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Pages (from-to) | 460-462 |
Number of pages | 3 |
Journal | IEEE Microwave and Wireless Components Letters |
Volume | 13 |
Issue number | 11 |
DOIs | |
State | Published - Nov 2003 |
Keywords
- Implantation
- Inductor
- Q-factor
- RF