Abstract
A high-density metal-insulator-metal (MIM) capacitor with a lanthanide-doped HfO2 dielectric prepared by physical vapor deposition (PVD) is presented for the first time. A significant improvement was shown in both the voltage coefficient of capacitance (VCC) and the leakage current density of MIM capacitor, yet the high capacitance density of HfO2 dielectrics was maintained by achieving the doping of Tb with an optimum concentration in HfO2. This technique allows utilizing thinner dielectric film in MIM capacitors and achieving a capacitance density as high as 13.3 fF/μm2 with leakage current and VCC values that fully meet requirements from year 2005 for radio frequency (RF) bypass capacitors applications.
Original language | English |
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Pages (from-to) | 442-444 |
Number of pages | 3 |
Journal | Ieee Electron Device Letters |
Volume | 24 |
Issue number | 7 |
DOIs | |
State | Published - Jul 2003 |
Keywords
- Capacitance density
- Co-sputtering
- HfO
- Lanthanide
- Metal-insulator-metal (MIM) capacitor
- Voltage coefficient of capacitor (VCC)