Job Sequencing and Scheduling

Tin Chih Toly Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

2 Scopus citations

Abstract

The semiconductor manufacturing process typically consists of four stages: wafer fabrication, wafer probe, assembly, and final test.

Original languageEnglish
Title of host publicationSpringerBriefs in Applied Sciences and Technology
PublisherSpringer Science and Business Media Deutschland GmbH
Pages77-100
Number of pages24
DOIs
StatePublished - 2023

Publication series

NameSpringerBriefs in Applied Sciences and Technology
ISSN (Print)2191-530X
ISSN (Electronic)2191-5318

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