@inproceedings{032b0958bb1b4eb9ad3b86b57260a239,
title = "Irregular Bumps Design Planning for Modern Ball Grid Array Packages",
abstract = "In modern flip-chip packages, bumps are often placed irregularly due to different design needs. It costs a great amount of time and manual effort to generate substrate routing from bumps through vias to package balls. Moreover, any single model in prior works could not be simultaneously applied between bumps, vias and balls. In this work, we propose a unified flow network model to formulate the 2-layer substrate routing problem on irregular package structure. We present a renovated bump model that can handle irregular bump plans, filling the gap/insufficiency in existing models. With our methodology, signal assignment on vias and balls, and substrate routing on two layers can be obtained at the same time. We also present an iterative optimization technique to further improve wire congestion. Our results show that the proposed method completes via and ball assignment efficiently, and obtain 100% routability while improving 16.45% in wirelength, compared with manual design in real industrial cases.",
keywords = "ball planning, irregular bump, irregular package, substrate routing",
author = "Chang, {Hsin Yu} and Hung-Ming Chen and Kuo, {Yun Chih} and Tsai, {Hsien Ting} and Chen, {Simon Yi Hung} and Jiang, {Jyun Ru} and Chien, {Ya Ying} and Chen, {Yu Yang}",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE. Copyright: Copyright 2020 Elsevier B.V., All rights reserved.; 70th IEEE Electronic Components and Technology Conference, ECTC 2020 ; Conference date: 03-06-2020 Through 30-06-2020",
year = "2020",
month = jun,
doi = "10.1109/ECTC32862.2020.00287",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1838--1843",
booktitle = "Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020",
address = "United States",
}