Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications

Tzu Heng Hung, Ting Cih Kang, Shan Yu Mao, Tzu Chieh Chou, Han Wen Hu, Hsih Yang Chiu, Chiang Lin Shih, Kuan Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

12 Scopus citations

Abstract

The main development challenge of low temperature hybrid bonding technology is the oxidation of Cu surface. The schemes to achieve the high-quality surface condition of Cu before bonding is urgently demanded. In this study, four acid solutions, including sulfuric acid (H2SO4), hydrochloric acid (HCl), acetic acid (CH3COOH) and citric acid (C6H8O7), were chosen as wet pretreatment approaches to remove Cu oxides based on the respective chemical reactions. To investigate the influence of these acid solutions on bonding surface, different acid immersion times are examined and the XPS analysis is conducted to check the surface component composition. Next, thermal compression bonding (TCB) is conducted after the Cu oxide removal process, followed by various analyses, including SAT analysis to validate bonding results, FIB and SEM analyses to inspect bonding interface, and pull test to measure bonding strength. The results of analyses verify the ability of different wet pretreatment to improve Cu-Cu bonding.

Original languageEnglish
Title of host publicationProceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages700-705
Number of pages6
ISBN (Electronic)9780738145235
DOIs
StatePublished - 2021
Event71st IEEE Electronic Components and Technology Conference, ECTC 2021 - Virtual, Online, United States
Duration: 1 Jun 20214 Jul 2021

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2021-June
ISSN (Print)0569-5503

Conference

Conference71st IEEE Electronic Components and Technology Conference, ECTC 2021
Country/TerritoryUnited States
CityVirtual, Online
Period1/06/214/07/21

Keywords

  • Cu oxide removal
  • Cu-Cu bonding
  • Wet pretreatment

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