Investigation of Low Temperature Co-Co Direct Bonding and Co-Passivated Cu-Cu Direct Bonding

Keyphrases

• 3D-IC Technology 50%
• Annealing Process 50%
• Bonding Interface 50%
• Bonding Layer 50%
• Bonding Material 50%
• Bonding Process 50%
• C-O Bond 100%
• Chip-level 50%
• Cu-Cu Bonding 100%
• Direct Bonding 100%
• EDX Analysis 50%
• High Electrical Performance 50%
• Interconnect Materials 100%
• Interdiffusion 50%
• Low Temperature 100%
• Mechanical Strength 50%
• Metal Bond 50%
• Metal Passivation 50%
• Next Generation Interconnect 50%
• Passivated 100%
• Passivation Layer 50%
• TEM-EDX 50%
• Wafer Level 50%

Engineering

• Annealing Process 33%
• Bonding Layer 33%
• Bonding Material 33%
• Bonding Process 33%
• Direct Bonding 100%
• Electrical Performance 33%
• Interconnects 66%
• Interdiffusion 33%
• Low-Temperature 100%
• Passivation Layer 33%