@inproceedings{36ca38d5794449bc94fd3503322d63d3,
title = "Investigation of Latch-Up Immunity in 0.18-f.1M BCD Process with Deep Trench Isolation",
abstract = "Deep Trench Isolation (DTI) is a specialized isolation technique employed in the BCD process to mitigate latch-up issues. Unlike junction isolation, which was typically implemented by guard rings, the DTI offers a significant reduction in layout area due to its physical isolation capabilities. This study delves into the impact of DTI on latch-up immunity between 100-V LDMOS in the I/O circuits and the additional guard ring between the 100-V I/O circuits and 5- V internal circuits. The results of this study will be benefit to the high-voltage IC products, that drawn with reduced layout spacing but having high latch-up immunity.",
keywords = "Deep Trench Isolation (DTI), LDMOS, Latch-up",
author = "Ho, {Wen Yung} and Ker, {Ming Dou} and Wang, {Chun Chi} and Chiang, {Tsung Yin} and Wei, {I. Ju}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 ; Conference date: 22-04-2024 Through 25-04-2024",
year = "2024",
doi = "10.1109/VLSITSA60681.2024.10546435",
language = "English",
series = "2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings",
address = "美國",
}