Investigation of Cu/In thermosonic bonding

Yan Pin Huang; Shu Lin Lu; Yu Shang Huang; Yi Hsiu Tseng; Min Fong Shu; Kuan-Neng Chen

doi:10.1166/jnn.2017.13872

Investigation of Cu/In thermosonic bonding

Yan Pin Huang, Shu Lin Lu, Yu Shang Huang, Yi Hsiu Tseng, Min Fong Shu, Kuan-Neng Chen^*

^*Corresponding author for this work

Institute of Electronics

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

In response to the current trend of multi-functional electronic products, integrated circuits become smaller with higher I/O counts. Thermosonic bonding is a potential microelectronic stacking technology for three-dimensional (3D) integration and advanced packaging. Therefore, it is important to comprehend the relation between strength and bonding condition. In this paper, parameters of ultrasonic vibration for low temperature Cu pillar to Cu/In bonding are investigated through shear test. Moreover, electrical performance is evaluated by Kelvin structure and Daisy chain. Experiment results show that heating temperature and bonding force possess a positive correlation with shear strength, which can be up to 39 MPa. In addition, it exhibits good electrical performance in the range of 10⁻⁸ Ω-cm² as well as high resistance to environmental degradation. This work provides guidelines of Cu/In thermosonic bonding for future fine pitch applications.

Original language	English
Pages (from-to)	8890-8893
Number of pages	4
Journal	Journal of Nanoscience and Nanotechnology
Volume	17
Issue number	12
DOIs	https://doi.org/10.1166/jnn.2017.13872
State	Published - Dec 2017

Keywords

Shear strength
Thermonsic bonding
Three dimensional integration

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10.1166/jnn.2017.13872

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title = "Investigation of Cu/In thermosonic bonding",

abstract = "In response to the current trend of multi-functional electronic products, integrated circuits become smaller with higher I/O counts. Thermosonic bonding is a potential microelectronic stacking technology for three-dimensional (3D) integration and advanced packaging. Therefore, it is important to comprehend the relation between strength and bonding condition. In this paper, parameters of ultrasonic vibration for low temperature Cu pillar to Cu/In bonding are investigated through shear test. Moreover, electrical performance is evaluated by Kelvin structure and Daisy chain. Experiment results show that heating temperature and bonding force possess a positive correlation with shear strength, which can be up to 39 MPa. In addition, it exhibits good electrical performance in the range of 10−8 Ω-cm2 as well as high resistance to environmental degradation. This work provides guidelines of Cu/In thermosonic bonding for future fine pitch applications.",

keywords = "Shear strength, Thermonsic bonding, Three dimensional integration",

author = "Huang, {Yan Pin} and Lu, {Shu Lin} and Huang, {Yu Shang} and Tseng, {Yi Hsiu} and Shu, {Min Fong} and Kuan-Neng Chen",

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doi = "10.1166/jnn.2017.13872",

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T1 - Investigation of Cu/In thermosonic bonding

AU - Huang, Yan Pin

AU - Lu, Shu Lin

AU - Huang, Yu Shang

AU - Tseng, Yi Hsiu

AU - Shu, Min Fong

AU - Chen, Kuan-Neng

PY - 2017/12

Y1 - 2017/12

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AB - In response to the current trend of multi-functional electronic products, integrated circuits become smaller with higher I/O counts. Thermosonic bonding is a potential microelectronic stacking technology for three-dimensional (3D) integration and advanced packaging. Therefore, it is important to comprehend the relation between strength and bonding condition. In this paper, parameters of ultrasonic vibration for low temperature Cu pillar to Cu/In bonding are investigated through shear test. Moreover, electrical performance is evaluated by Kelvin structure and Daisy chain. Experiment results show that heating temperature and bonding force possess a positive correlation with shear strength, which can be up to 39 MPa. In addition, it exhibits good electrical performance in the range of 10−8 Ω-cm2 as well as high resistance to environmental degradation. This work provides guidelines of Cu/In thermosonic bonding for future fine pitch applications.

KW - Shear strength

KW - Thermonsic bonding

KW - Three dimensional integration

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Investigation of Cu/In thermosonic bonding

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Keywords

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