Investigation of bonding mechanism for low-temperature Cu–Cu bonding with passivation layer

Zhong Jie Hong, Demin Liu, Han Wen Hu, Chih I. Cho, Ming Wei Weng, Jui Han Liu, Kuan Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

22 Scopus citations

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Chemical Compounds

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