Introduction to the Special Issue on the 2019 IEEE International Solid-State Circuits Conference (ISSCC)

Tony Chan Carusone*, Mingoo Seok, Hsie Chia Chang, Meng Fan Chang

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

Abstract

This Special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best articles selected from the 2019 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 17-21, 2019, in San Francisco, CA, USA. This Special Issue covers articles from the Wireline, Digital Circuits, Digital Architectures and Systems (DASs), and Memory Committees.

Original languageEnglish
Article number8944228
Pages (from-to)3-5
Number of pages3
JournalIEEE Journal of Solid-State Circuits
Volume55
Issue number1
DOIs
StatePublished - 27 Dec 2019

Fingerprint

Dive into the research topics of 'Introduction to the Special Issue on the 2019 IEEE International Solid-State Circuits Conference (ISSCC)'. Together they form a unique fingerprint.

Cite this