Intermetallic compounds in 3D integrated circuits technology: a brief review

Syahira Annuar; Reza Mahmoodian; Mohd Hamdi; King-Ning Tu

doi:10.1080/14686996.2017.1364975

Intermetallic compounds in 3D integrated circuits technology: a brief review

Syahira Annuar, Reza Mahmoodian^*, Mohd Hamdi, King-Ning Tu

^*Corresponding author for this work

International College of Semiconductor Technology

Research output: Contribution to journal › Review article › peer-review

75 Scopus citations

Abstract

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

Original language	English
Pages (from-to)	693-703
Number of pages	11
Journal	Science and Technology of Advanced Materials
Volume	18
Issue number	1
DOIs	https://doi.org/10.1080/14686996.2017.1364975
State	Published - 31 Dec 2017

Keywords

3D-ICs
IMCs
Pb-free solder joint
low-volume solder microbumps
microbumps

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10.1080/14686996.2017.1364975

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title = "Intermetallic compounds in 3D integrated circuits technology: a brief review",

abstract = "The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.",

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Intermetallic compounds in 3D integrated circuits technology: a brief review

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Keywords

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