Intelligent reticle modification enabled large-area metalens patterning

Chun Yen Chou*, Hsueh Li Liu, Lin Chia Huang, Wilson Guo, Pei-Chen Yu, You Chia Chang, Yao-Wei Huang, Jia Min Shieh

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


Dielectric metalenses realized by economic photolithography technology are vital to their mass deployment in optoelectronic applications. However, pattern fidelity has become a serious issue that degrades the device performance due to optical proximity effects. Here, we demonstrate an intelligent reticle modification system which modifies the sizes and shapes of designed patterns based on a neural-network U-net lithographic model to produce nanostructures with desired dimensions. We demonstrate 2mm-diameter visible metalenses with diffraction-limited focusing using DUV KrF 248 nm photolithography. This work bridges between the semiconductor process and lens-making industries to realize high-volume manufacturing of versatile metalens and metasurface products.

Original languageEnglish
Title of host publicationNanoengineering
Subtitle of host publicationFabrication, Properties, Optics, Thin Films, and Devices XX
EditorsBalaji Panchapakesan, Andre-Jean Attias, Andre-Jean Attias, Wounjhang Park
ISBN (Electronic)9781510665200
StatePublished - 2023
EventNanoengineering: Fabrication, Properties, Optics, Thin Films, and Devices XX 2023 - San Diego, United States
Duration: 20 Aug 202321 Aug 2023

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


ConferenceNanoengineering: Fabrication, Properties, Optics, Thin Films, and Devices XX 2023
Country/TerritoryUnited States
CitySan Diego


  • Critical dimension(CD)
  • DUV photolithography
  • Intelligent proximity correction(IPC)
  • Metalens
  • Optical proximity correction (OPC)
  • U-Net


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