Integration, electrical performance, and Reliability Investigation of TSV

S. W. Lee; Y. C. Hu; C. H. Chiang; K. H. Chen; C. T. Chiu; C. T. Chuang; Wei Hwang; Jin-Chern Chiou; H. M. Tong; Kuan-Neng Chen

doi:10.4071/2013DPC-tha12

Integration, electrical performance, and Reliability Investigation of TSV

S. W. Lee, Y. C. Hu, C. H. Chiang, K. H. Chen, C. T. Chiu, C. T. Chuang, Wei Hwang, Jin-Chern Chiou, H. M. Tong, Kuan-Neng Chen

Department of Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Original language	English
Title of host publication	International Conference and Exhibition on Device Packaging 2013
Pages	172-186
Number of pages	15
DOIs	https://doi.org/10.4071/2013DPC-tha12
State	Published - 18 Dec 2013
Event	9th International Conference and Exhibition on Device Packaging, DPC 2013 - Scottsdale/Fountain Hills, AZ, United States Duration: 11 Mar 2013 → 14 Mar 2013

Publication series

Name	International Conference and Exhibition on Device Packaging 2013

Conference

Conference	9th International Conference and Exhibition on Device Packaging, DPC 2013
Country/Territory	United States
City	Scottsdale/Fountain Hills, AZ
Period	11/03/13 → 14/03/13

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10.4071/2013DPC-tha12

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Lee, S. W., Hu, Y. C., Chiang, C. H., Chen, K. H., Chiu, C. T., Chuang, C. T., Hwang, W., Chiou, J-C., Tong, H. M., & Chen, K-N. (2013). Integration, electrical performance, and Reliability Investigation of TSV. In International Conference and Exhibition on Device Packaging 2013 (pp. 172-186). (International Conference and Exhibition on Device Packaging 2013). https://doi.org/10.4071/2013DPC-tha12

@inproceedings{fa101ef5bddc4904ad69338479fc2ee7,

title = "Integration, electrical performance, and Reliability Investigation of TSV",

author = "Lee, {S. W.} and Hu, {Y. C.} and Chiang, {C. H.} and Chen, {K. H.} and Chiu, {C. T.} and Chuang, {C. T.} and Wei Hwang and Jin-Chern Chiou and Tong, {H. M.} and Kuan-Neng Chen",

year = "2013",

month = dec,

day = "18",

doi = "10.4071/2013DPC-tha12",

language = "English",

isbn = "9781627487740",

series = "International Conference and Exhibition on Device Packaging 2013",

pages = "172--186",

booktitle = "International Conference and Exhibition on Device Packaging 2013",

note = "null ; Conference date: 11-03-2013 Through 14-03-2013",

}

Lee, SW, Hu, YC, Chiang, CH, Chen, KH, Chiu, CT, Chuang, CT, Hwang, W, Chiou, J-C, Tong, HM & Chen, K-N 2013, Integration, electrical performance, and Reliability Investigation of TSV. in International Conference and Exhibition on Device Packaging 2013. International Conference and Exhibition on Device Packaging 2013, pp. 172-186, 9th International Conference and Exhibition on Device Packaging, DPC 2013, Scottsdale/Fountain Hills, AZ, United States, 11/03/13. https://doi.org/10.4071/2013DPC-tha12

Integration, electrical performance, and Reliability Investigation of TSV. / Lee, S. W.; Hu, Y. C.; Chiang, C. H. et al.

International Conference and Exhibition on Device Packaging 2013. 2013. p. 172-186 (International Conference and Exhibition on Device Packaging 2013).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Integration, electrical performance, and Reliability Investigation of TSV

AU - Lee, S. W.

AU - Hu, Y. C.

AU - Chiang, C. H.

AU - Chen, K. H.

AU - Chiu, C. T.

AU - Chuang, C. T.

AU - Hwang, Wei

AU - Chiou, Jin-Chern

AU - Tong, H. M.

AU - Chen, Kuan-Neng

PY - 2013/12/18

Y1 - 2013/12/18

UR - http://www.scopus.com/inward/record.url?scp=84890304676&partnerID=8YFLogxK

U2 - 10.4071/2013DPC-tha12

DO - 10.4071/2013DPC-tha12

M3 - Conference contribution

AN - SCOPUS:84890304676

SN - 9781627487740

T3 - International Conference and Exhibition on Device Packaging 2013

SP - 172

EP - 186

BT - International Conference and Exhibition on Device Packaging 2013

Y2 - 11 March 2013 through 14 March 2013

ER -

Integration, electrical performance, and Reliability Investigation of TSV

Publication series

Conference

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