Integrated microspacecraft avionics architecture using 3D multichip module building blocks

Leon Alkalai; Wai-Chi  Fang

doi:10.1109/ICCD.1996.563548

Integrated microspacecraft avionics architecture using 3D multichip module building blocks

Leon Alkalai^*, Wai-Chi Fang

^*Corresponding author for this work

Institute of Electronics

Research output: Contribution to conference › Paper › peer-review

3 Scopus citations

Abstract

Multichip module (MCM) technology is used to develop a highly miniaturized three-dimensional avionics architecture for future low-cost space exploration missions. The architecture maximizes the leverage of commercial high-volume software and hardware solutions by using standard interfaces for both the local bus and the inter-node system bus. This approach improves system reliability at a very low cost.

Original language	English
Pages	141-144
Number of pages	4
DOIs	https://doi.org/10.1109/ICCD.1996.563548
State	Published - 1 Dec 1996
Event	Proceedings of the 1996 International Conference on Computer Design, ICCD'96 - Austin, TX, USA Duration: 7 Oct 1996 → 9 Oct 1996

Conference

Conference	Proceedings of the 1996 International Conference on Computer Design, ICCD'96
City	Austin, TX, USA
Period	7/10/96 → 9/10/96

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10.1109/ICCD.1996.563548

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@conference{9d9a7c1d60a04d79bf51ff4604559f61,

title = "Integrated microspacecraft avionics architecture using 3D multichip module building blocks",

abstract = "Multichip module (MCM) technology is used to develop a highly miniaturized three-dimensional avionics architecture for future low-cost space exploration missions. The architecture maximizes the leverage of commercial high-volume software and hardware solutions by using standard interfaces for both the local bus and the inter-node system bus. This approach improves system reliability at a very low cost.",

author = "Leon Alkalai and Wai-Chi Fang",

year = "1996",

month = dec,

day = "1",

doi = "10.1109/ICCD.1996.563548",

language = "English",

pages = "141--144",

note = "Proceedings of the 1996 International Conference on Computer Design, ICCD'96 ; Conference date: 07-10-1996 Through 09-10-1996",

}

TY - CONF

T1 - Integrated microspacecraft avionics architecture using 3D multichip module building blocks

AU - Alkalai, Leon

AU - Fang, Wai-Chi

PY - 1996/12/1

Y1 - 1996/12/1

N2 - Multichip module (MCM) technology is used to develop a highly miniaturized three-dimensional avionics architecture for future low-cost space exploration missions. The architecture maximizes the leverage of commercial high-volume software and hardware solutions by using standard interfaces for both the local bus and the inter-node system bus. This approach improves system reliability at a very low cost.

AB - Multichip module (MCM) technology is used to develop a highly miniaturized three-dimensional avionics architecture for future low-cost space exploration missions. The architecture maximizes the leverage of commercial high-volume software and hardware solutions by using standard interfaces for both the local bus and the inter-node system bus. This approach improves system reliability at a very low cost.

UR - http://www.scopus.com/inward/record.url?scp=0030409633&partnerID=8YFLogxK

U2 - 10.1109/ICCD.1996.563548

DO - 10.1109/ICCD.1996.563548

M3 - Paper

AN - SCOPUS:0030409633

SP - 141

EP - 144

T2 - Proceedings of the 1996 International Conference on Computer Design, ICCD'96

Y2 - 7 October 1996 through 9 October 1996

ER -

Integrated microspacecraft avionics architecture using 3D multichip module building blocks

Abstract

Conference

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