@inproceedings{53efa259246147a6a5c1238be249af5c,
title = "Integrated microprobe array and CMOS MEMS by TSV technology for bio-signal recording application",
abstract = "Bio-signal probes that provide stable observation with high-quality signals are crucial for understanding how the brain works and how the neural signal transmits. Because bio-signals are weak and noisy, the length of the string connecting the sensor and Complementary Metal-Oxide-Semiconductor (CMOS) circuit significantly impacts biosignal quality. The collected weak signals from the sensor must pass through a series of interconnections and interfaces that introduce noise and lead to bulky packaged systems. This work uses through-silicon via (TSV) technology to connect the μ-probe array bio-sensor and CMOS circuit located on opposite sides of a chip for brain neural sensing applications. With the elimination of wire bonding and the reduction of the soldering, bio-signal quality can be significantly improved.",
author = "Chou, {Lei Chun} and Lee, {Shih Wei} and Po-Tsang Huang and Chang, {Chih Wei} and Wu, {Shang Lin} and Jin-Chern Chiou and Chuang, {Ching Te} and Wei Hwang and Wu, {Chung Hsi} and Chen, {Kuo Hua} and Chiu, {Chi Tsung} and Tong, {Ho Ming} and Kuan-Neng Chen",
year = "2014",
month = sep,
day = "11",
doi = "10.1109/ECTC.2014.6897332",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "512--517",
booktitle = "Proceedings - Electronic Components and Technology Conference",
address = "United States",
note = "null ; Conference date: 27-05-2014 Through 30-05-2014",
}