Influence of Post-Ion-Implantation Annealing Temperature on the Characteristics of Gate Oxide on 4H Silicon Carbide

Li Jung Lin, Bing Yue Tsui*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

Abstract

The effect of post-ion implantation annealing on the properties of the SiO2/4H-SiC interface is examined in this paper. It is observed that the surface roughness degrades after the hightemperature Ar annealing, but the oxidation process after the high temperature annealing can improve the surface roughness. To better understand the effect of high-temperature annealing on the gate oxide, the reliability of gate oxide is further studied. The results show that although the surface roughness degrades after high-temperature annealing, the interface state density, tunneling barrier height, breakdown field, and critical electric field for the 10-year lifetime of the thermally grown gate oxide do not degrade.

Original languageEnglish
Title of host publicationMaterials Science Forum
PublisherTrans Tech Publications Ltd.
Pages107-111
Number of pages5
DOIs
StatePublished - 2023

Publication series

NameMaterials Science Forum
Volume1090
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Keywords

  • interface state density
  • MOS capacitor
  • Post-ion-implantation annealing
  • Silicon carbide
  • SiO/4H-SiC interface
  • surface roughness
  • time-dependent dielectric breakdown

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