Improved manufacturability of Cu bond pads and implementation of seal design in 3D integrated circuits and packages

Kuan-Neng Chen, C. K. Tsang, A. W. Topol, S. H. Lee, B. K. Furraan, D. L. Rath, J. Q. Lu, A. M. Young, S. Purushothaman, W. Haensch

    Research output: Contribution to conferencePaperpeer-review

    10 Scopus citations

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    Engineering & Materials Science