Abstract
In our previous study, using NF3 annealed poly-Si to improve gate oxide integrity for Co-silicide process has been proposed [SSDM, 1998, p. 164]. It is very interesting and important to know the mechanism of both F and N incorporation in the SiO2 and Co-salicide. In this study, F and/or N will be implanted into poly-Si with/without Co-salicide process, to identify the interaction of N and F in the SiO2 and Co-salicide process. In our work, we will describe the optimized structure and F/N incorporation for Co-silicide process.
Original language | English |
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Pages (from-to) | 1097-1101 |
Number of pages | 5 |
Journal | Solid-State Electronics |
Volume | 46 |
Issue number | 8 |
DOIs | |
State | Published - 1 Aug 2002 |
Keywords
- Breakdown charge and stress induce leakage current (SILC)
- Co-salicide
- Fluorine and nitrogen implantation
- Gate oxide integrity (GOI)
- Leakage performance