Hybrid Soldering 2.3D Assembly with High Reliability and Low Cost

Han Wen Hu, Yu Wei Huang, Yi Chieh Tsai, Meng Kai Shih, Kuan Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Fingerprint

Dive into the research topics of 'Hybrid Soldering 2.3D Assembly with High Reliability and Low Cost'. Together they form a unique fingerprint.

Keyphrases

Material Science

Engineering

Chemical Engineering