@inproceedings{9e627ac665974b099b8a9f75f805c578,
title = "Hybrid Bonding of Nanotwinned Copper/organic Dielectrics with Low Thermal Budget",
abstract = "The temperature for hybrid bonding is favorably to be lower than 250 {\'c}, and thus nanotwinned Cu (nt-Cu) and low curing temperature dielectrics were combined to achieve that. To facilitate the fabrication of highly (111)-oriented surface of nt-Cu, Cu first process was chosen. In contrast to damascene Cu process, Cu first process changed the sequences of dielectric coating and Cu electroplating processes. In this study, patterned nt-Cu was plated first, and then dielectric was added in the process before or after chemical mechanical planarization (CMP). Low-temperature polyimide (PI) and non-conductive paste (NCP) were used to conduct two kinds of processes of hybrid bonding. If PI was coated and partially cured on a patterned wafer before CMP, co-planarization of nt-Cu/PI should be done afterwards to fabricate Cu/PI structure. The Cu/PI hybrid bonding can be achieved at 200 {\'c} for 30 min. If a patterned wafer was planarized firstly, NCP was dropped on the samples and bonding process can be carried out at 180 {\'c} for 2 h. This process was denoted as Cu + NCP hybrid bonding. The above two methods of hybrid bonding could be achieved under 250 {\'c}, and might be the solutions for hybrid bonding technology with low thermal budget.",
keywords = "Cu first process, Hybrid bonding, NCP, Nanotwinned Cu, No-flow underfilling, Organic dielectric, PI",
author = "Shie, {Kai Cheng} and He, {Pin Syuan} and Kuo, {Yu Hao} and Ong, {Jia Juen} and Tu, {K. N.} and Lin, {Benson Tzu Hung} and Chang, {Chia Cheng} and Chih Chen",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE; 71st IEEE Electronic Components and Technology Conference, ECTC 2021 ; Conference date: 01-06-2021 Through 04-07-2021",
year = "2021",
doi = "10.1109/ECTC32696.2021.00079",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "432--437",
booktitle = "Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021",
address = "美國",
}