Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation

Yi Lun Yang*, Jia Ling Liu, Guan Wei Chen, Shoichi Kodama, Kyosuke Kobinata, Kuan-Neng Chen, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

In this study, a sandwich structure (silicon/polymer/silicon) was prepared to demonstrate the adhesion strength between polymer and silicon layers using a four-point bending system. For the first time, the stealth dicing (SD) method was applied to the silicon layer to generate an initial crack, and the SD method was compared with the traditional method of forming a trench by blade dicing. From the experimental results, the SD method improved the test yield and showed a lower level of sudden force drop. As a result, SD is a highly reliable way to measure the adhesion strength using a four-point bending system.

Original languageEnglish
Title of host publication2019 International Conference on Electronics Packaging, ICEP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages28-31
Number of pages4
ISBN (Electronic)9784990218867
DOIs
StatePublished - 17 Apr 2019
Event2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
Duration: 17 Apr 201920 Apr 2019

Publication series

Name2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
Country/TerritoryJapan
CityNiigata
Period17/04/1920/04/19

Keywords

  • Adhesion Strength
  • Four-Point Bending System
  • Stealth Dicing Method

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