TY - JOUR
T1 - High Thermally Stable Anthracene-Based Polyimides with Low Dielectric Constants and Dissipation Factors
AU - Lee, Yueh Hsing
AU - Lin, Jin Wei
AU - Huang, Yu Chen
AU - Huang, Yung Jen
AU - Busireddy, Manohar Reddy
AU - Chen, Jiun Tai
AU - Hsu, Chain Shu
N1 - Publisher Copyright:
© 2023 American Chemical Society.
PY - 2023/12/8
Y1 - 2023/12/8
N2 - At present, high-performance polymers with low dielectric constants (Dk) and low dissipation factors (Df) have gained much attention with the rapid evolution of microelectronic and 5G communication technologies. Due to their excellent thermal stabilities, heat resistances, mechanical strengths, and dielectric properties, polyimides (PIs) have attracted a lot of attention. Herein, a series of anthracene (An)-based PIs are synthesized from an ester-functionalized anthracene diamine (An-NH2) monomer and four kinds of commercial dianhydrides such as keto (3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA)), sulfone (3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA)), fluoro (4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA)), and ether (4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA) and 4,4-oxydiphthalic anhydride (ODPA)) functional groups by a two-step process, i.e., the chemical polyaddition followed by thermal imidization. The resulting An-NH2/BTDA, An-NH2/DSDA, An-NH2/6FDA, An-NH2/BPADA, and An-NH2/ODPA PIs are denoted as AnBT-PI, AnDS-PI, An6F-PI, AnBPA-PI, and AnOD-PI, respectively. As a result, all An-based PI films display excellent thermal properties, with thermal decomposition temperatures of 450-530 °C (Td5% weight loss) and glass transition temperatures (Tg) of 270-410 °C. In addition, these PI films exhibit decent optical transparency, flexibility, coefficient of thermal expansion (CTE), and mechanical properties. Remarkably, all An-based PI films show excellent dielectric properties with a low Dk of 2.540-3.388 and a Df of 0.0059-0.0240 at high frequency (10 GHz). In particular, the An-based PI films with ether linkages (AnOD-PI and AnBPA-PI) and a high fluorine content (An6F-PI) show low Dk and Df values compared with those with keto (AnBT-PI) and sulfone (AnDS-PI) linkages. These results indicate that the An-based PIs are promising candidates for achieving low Dk and Df values at higher frequencies.
AB - At present, high-performance polymers with low dielectric constants (Dk) and low dissipation factors (Df) have gained much attention with the rapid evolution of microelectronic and 5G communication technologies. Due to their excellent thermal stabilities, heat resistances, mechanical strengths, and dielectric properties, polyimides (PIs) have attracted a lot of attention. Herein, a series of anthracene (An)-based PIs are synthesized from an ester-functionalized anthracene diamine (An-NH2) monomer and four kinds of commercial dianhydrides such as keto (3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA)), sulfone (3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA)), fluoro (4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA)), and ether (4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA) and 4,4-oxydiphthalic anhydride (ODPA)) functional groups by a two-step process, i.e., the chemical polyaddition followed by thermal imidization. The resulting An-NH2/BTDA, An-NH2/DSDA, An-NH2/6FDA, An-NH2/BPADA, and An-NH2/ODPA PIs are denoted as AnBT-PI, AnDS-PI, An6F-PI, AnBPA-PI, and AnOD-PI, respectively. As a result, all An-based PI films display excellent thermal properties, with thermal decomposition temperatures of 450-530 °C (Td5% weight loss) and glass transition temperatures (Tg) of 270-410 °C. In addition, these PI films exhibit decent optical transparency, flexibility, coefficient of thermal expansion (CTE), and mechanical properties. Remarkably, all An-based PI films show excellent dielectric properties with a low Dk of 2.540-3.388 and a Df of 0.0059-0.0240 at high frequency (10 GHz). In particular, the An-based PI films with ether linkages (AnOD-PI and AnBPA-PI) and a high fluorine content (An6F-PI) show low Dk and Df values compared with those with keto (AnBT-PI) and sulfone (AnDS-PI) linkages. These results indicate that the An-based PIs are promising candidates for achieving low Dk and Df values at higher frequencies.
KW - anthracene
KW - coefficient of thermal expansion
KW - high thermal stability
KW - low dielectric constant
KW - low dissipation factor
KW - polyimides
UR - http://www.scopus.com/inward/record.url?scp=85179152132&partnerID=8YFLogxK
U2 - 10.1021/acsapm.3c02003
DO - 10.1021/acsapm.3c02003
M3 - Article
AN - SCOPUS:85179152132
SN - 2637-6105
VL - 5
SP - 10196
EP - 10204
JO - ACS Applied Polymer Materials
JF - ACS Applied Polymer Materials
IS - 12
ER -