Abstract
In this letter, fully Ni self-aligned silicided (fully Ni-salicided) source/drain (S/D) and gate polycrystalline silicon thin-film transistors (FSA-TFTs) have been successfully fabricated on a 40-nm-thick channel layer. Experimental results show that the FSA-TFTs give increased ON/OFF current ratio, improved subthreshold characteristics, less threshold voltage rolloff, and larger field-effect mobility compared with conventional TFTs. The FSA-TFTs exhibit small S/D and gate parasitic resistance and effectively suppress the floating-body effect and parasitic bipolar junction transistor action. The characteristics of the FSA-TFTs are suitable for high-performance driving TFTs with good output characteristics and large breakdown voltage.
Original language | English |
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Pages (from-to) | 258-261 |
Number of pages | 4 |
Journal | IEEE Electron Device Letters |
Volume | 27 |
Issue number | 4 |
DOIs | |
State | Published - 1 Apr 2006 |
Keywords
- Floating-body effect
- Fully salicided
- Parasitic bipolar junction transistor
- Polycrystalline silicon thin-film transistors (poly-Si TFTs)