High performance and reliability of poly-Si thin-film transistors using nickel drive-in induced laterally crystallization

Yew-Chuhg Wu, Chih Pang Chang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this study, polycrystalline silicon thin film transistors using drive-in Ni induced lateral crystallization (DILC) was proposed. In DILC, F+ implantation was used to drive Ni in the α-Si layer. To reduce the Ni contamination, the remained Ni film was then removed, and subsequently annealed at 590°C It was found DILC TFTs exhibit high field-effect mobility, low threshold voltage, low subthreshold slope, high on-state current, lower trap state density, smaller standard deviations, and low off-state leakage current compared with conventional Ni-metal-induced lateral crystallization (MILC) TFTs.

Original languageEnglish
Title of host publicationThin Film Transistors 10, TFT 10
Pages193-195
Number of pages3
Edition5
DOIs
StatePublished - 1 Dec 2010
Event10th Symposium on Thin Film Transistor Technologies, TFT 10 - 218th ECS Meeting - Las Vegas, NV, United States
Duration: 11 Oct 201015 Oct 2010

Publication series

NameECS Transactions
Number5
Volume33
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

Conference10th Symposium on Thin Film Transistor Technologies, TFT 10 - 218th ECS Meeting
Country/TerritoryUnited States
CityLas Vegas, NV
Period11/10/1015/10/10

Fingerprint

Dive into the research topics of 'High performance and reliability of poly-Si thin-film transistors using nickel drive-in induced laterally crystallization'. Together they form a unique fingerprint.

Cite this