High Performance ALD HfO 2-Al 2O 3 Laminate MIM Capacitors for RF and Mixed Signal IC Applications

  • Hang Hu*
  • , Shi Jin Ding
  • , H. F. Lim
  • , Chunxiang Zhu
  • , M. F. Li
  • , S. J. Kim
  • , X. F. Yu
  • , J. H. Chen
  • , Y. F. Yong
  • , Byung Jin Cho
  • , D. S.H. Chan
  • , Subhash C. Rustagi
  • , M. B. Yu
  • , C. H. Tung
  • , Anyan Du
  • , Doan My
  • , P. D. Foo
  • , Albert Chin
  • , Dim Lee Kwong
  • *Corresponding author for this work

    Research output: Contribution to journalConference articlepeer-review

    40 Scopus citations

    Abstract

    In this paper, high performance ALD HfO 2-Al 2O 3 laminate metal-insulator-metal (MIM) capacitor is demonstrated for the first time with high capacitance density of 12.8 fF/μm 2 from 10 kHz to 20 GHz, low leakage current of 7.45×10 -9 A/cm 2@2V, low VCC (voltage coefficients of capacitance), and excellent reliability. The superior electrical properties and reliability suggest that the ALD HfO 2-Al 2O 3 laminate is a very promising material for MIM capacitors for Si RF and mixed signal IC applications.

    Original languageEnglish
    Pages (from-to)379-382
    Number of pages4
    JournalTechnical Digest - International Electron Devices Meeting
    StatePublished - Dec 2003
    EventIEEE International Electron Devices Meeting - Washington, DC, United States
    Duration: 8 Dec 200310 Dec 2003

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