Abstract
A 3D trenched-structure metal-insulator-metal (MIM) nanocapacitor array with an ultrahigh equivalent planar capacitance (EPC) of ∼300 μF cm -2 is demonstrated. Zinc oxide (ZnO) and aluminum oxide (Al 2O3) bilayer dielectric is deposited on 1 μm high biomimetic silicon nanotip (SiNT) substrate using the atomic layer deposition method. The large EPC is achieved by utilizing the large surface area of the densely packed SiNT (∼5 × 1010 cm-2) coated conformally with an ultrahigh dielectric constant of ZnO. The EPC value is 30 times higher than those previously reported in metal-insulator-metal or metal-insulator-semiconductor nanocapacitors using similar porosity dimensions of the support materials.
| Original language | English |
|---|---|
| Pages (from-to) | 1422-1428 |
| Number of pages | 7 |
| Journal | Nano letters |
| Volume | 13 |
| Issue number | 4 |
| DOIs | |
| State | Published - 10 Apr 2013 |
Keywords
- Zinc oxide
- equivalent planar capacitance
- nanophase
- silicon nanotip array
- supercapacitors
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