High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes

Che Hsuan Huang; Kuo Ju Chen; Ming Ta Tsai; Min Hsiung Shih; Chia-Wei Sun; Wei-I Lee; Chien-Chung Lin; Hao-Chung Kuo

doi:10.1117/1.JPE.5.057606

High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes

Che Hsuan Huang, Kuo Ju Chen, Ming Ta Tsai, Min Hsiung Shih, Chia-Wei Sun, Wei-I Lee, Chien-Chung Lin, Hao-Chung Kuo^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

17 Scopus citations

Abstract

This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications.

Original language	English
Article number	14087SS
Pages (from-to)	57606
Number of pages	1
Journal	Journal of Photonics for Energy
Volume	5
Issue number	1
DOIs	https://doi.org/10.1117/1.JPE.5.057606
State	Published - 21 Apr 2015

Keywords

backlight unit
chip-scale
light-emitting diode
lighting
phosphor

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1117/1.JPE.5.057606

Cite this

@article{93b055c3cd62493f85102c2ba9fe8e99,

title = "High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes",

abstract = "This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications.",

keywords = "backlight unit, chip-scale, light-emitting diode, lighting, phosphor",

author = "Huang, {Che Hsuan} and Chen, {Kuo Ju} and Tsai, {Ming Ta} and Shih, {Min Hsiung} and Chia-Wei Sun and Wei-I Lee and Chien-Chung Lin and Hao-Chung Kuo",

note = "Publisher Copyright: {\textcopyright} 2015 Society of Photo-Optical Instrumentation Engineers (SPIE).",

year = "2015",

month = apr,

day = "21",

doi = "10.1117/1.JPE.5.057606",

language = "English",

volume = "5",

pages = "57606",

journal = "Journal of Photonics for Energy",

issn = "1947-7988",

publisher = "SPIE",

number = "1",

}

TY - JOUR

T1 - High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes

AU - Huang, Che Hsuan

AU - Chen, Kuo Ju

AU - Tsai, Ming Ta

AU - Shih, Min Hsiung

AU - Sun, Chia-Wei

AU - Lee, Wei-I

AU - Lin, Chien-Chung

AU - Kuo, Hao-Chung

PY - 2015/4/21

Y1 - 2015/4/21

N2 - This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications.

AB - This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications.

KW - backlight unit

KW - chip-scale

KW - light-emitting diode

KW - lighting

KW - phosphor

UR - http://www.scopus.com/inward/record.url?scp=84929167603&partnerID=8YFLogxK

U2 - 10.1117/1.JPE.5.057606

DO - 10.1117/1.JPE.5.057606

M3 - Article

AN - SCOPUS:84929167603

SN - 1947-7988

VL - 5

SP - 57606

JO - Journal of Photonics for Energy

JF - Journal of Photonics for Energy

IS - 1

M1 - 14087SS

ER -

High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes

Abstract

Keywords

UN SDGs

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