Guest Editorial Introduction to the Special Section on the 2023 IEEE International Solid-State Circuits Conference (ISSCC)

James F. Buckwalter, Alireza Zolfaghari, Drew A. Hall*, Ke Horng Chen, Dominique Morche

*Corresponding author for this work

Research output: Contribution to journalEditorial

Abstract

This Special Section of IEEE JOURNAL OF SOLID-STATE CIRCUITS (JSSC) highlights outstanding papers presented at the 2023 IEEE International Solid-State Circuits Conference (ISSCC), which was held from February 19 to 23, 2023, in San Francisco, USA, under the conference theme 'Building on 70 Years of Innovation in Solid-State Circuit Design.' ISSCC is the foremost global forum for the presentation of advances in solid-state circuits and systems-on-a-chip and offers a unique opportunity for engineers working at the cutting edge of integrated circuit (IC) design and application. The conference includes several technical programs ranging from analog to mixed-mode, digital, radio frequency (RF), and power management circuits and systems with applications in various fields. This JSSC Special Section highlights selected papers from ISSCC, specifically on topics related to RF, wireless, analog, power management, and data converter circuits.

Original languageEnglish
Pages (from-to)3291-3295
Number of pages5
JournalIEEE Journal of Solid-State Circuits
Volume58
Issue number12
DOIs
StatePublished - 1 Dec 2023

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