Abstract
We have fabricated the fully silicided NiSi and germanided MGe dual gates n- and p-MOSFETs on 1.9 nm thick SiO 2 gate dielectric. The extracted work functions of fully NiSi and NiGe gates from thickness-dependent flat band voltage were 4.55 and 5.2 eV respectively, which may provide possible wide work function tuning using NiSi 1-xGe x. In additional to the lower gate current than Al gate n- and p-MOSFETs, the fully silicided NiSi and germanided NiGe gates MOSFETs show electron and hole mobilities close to universal mobility values with special advantage of process compatible to current VLSI fabrication line.
Original language | English |
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Pages (from-to) | 739-741 |
Number of pages | 3 |
Journal | Ieee Electron Device Letters |
Volume | 24 |
Issue number | 12 |
DOIs | |
State | Published - Dec 2003 |
Keywords
- MOSFET
- NiGe
- NiSi