Fine-pitch <111>-oriented NT-Cu/SiO2hybrid joints with high thermal fatigue resistance and low contact resistivity

Jia Juen Ong; Wei Lan Chiu; Hsiang Hung Chang; Dinh Phuc Tran; Chih Chen

doi:10.23919/ICEP58572.2023.10129702

Fine-pitch <111>-oriented NT-Cu/SiO₂hybrid joints with high thermal fatigue resistance and low contact resistivity

Jia Juen Ong
, Wei Lan Chiu
, Hsiang Hung Chang
, Dinh Phuc Tran
, Chih Chen^*

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

Fine-pitched NT-Cu/SiO2 hybrid bonding can be successfully fabricated under 200 °C by deploying highly <111>-oriented NT-Cu as bonding metal. To further study the reliability to the thermal fatigue, TCT and HTS conducted. According to JEDEC test standard, all sample passed by within ~7% of resistance increment.

Original language	English
Title of host publication	2023 International Conference on Electronics Packaging, ICEP 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	15-16
Number of pages	2
ISBN (Electronic)	9784991191152
DOIs	https://doi.org/10.23919/ICEP58572.2023.10129702
State	Published - 2023
Event	22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan Duration: 19 Apr 2023 → 22 Apr 2023

Publication series

Name	2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference	22nd International Conference on Electronics Packaging, ICEP 2023
Country/Territory	Japan
City	Kumamoto
Period	19/04/23 → 22/04/23

Keywords

Fine-pitch Cu/SiOhybrid bonding
High thermal fatigue
Reliability analysis
low contact resistivity
low temperature bonding

Access to Document

10.23919/ICEP58572.2023.10129702

Cite this

Ong, J. J., Chiu, W. L., Chang, H. H., Tran, D. P., & Chen, C. (2023). Fine-pitch <111>-oriented NT-Cu/SiO₂hybrid joints with high thermal fatigue resistance and low contact resistivity. In 2023 International Conference on Electronics Packaging, ICEP 2023 (pp. 15-16). (2023 International Conference on Electronics Packaging, ICEP 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP58572.2023.10129702

Ong, Jia Juen ; Chiu, Wei Lan ; Chang, Hsiang Hung et al. / Fine-pitch <111>-oriented NT-Cu/SiO₂hybrid joints with high thermal fatigue resistance and low contact resistivity. 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 15-16 (2023 International Conference on Electronics Packaging, ICEP 2023).

@inproceedings{06cd12b026be43c79a4ea707bf28b193,

title = "Fine-pitch <111>-oriented NT-Cu/SiO2hybrid joints with high thermal fatigue resistance and low contact resistivity",

abstract = "Fine-pitched NT-Cu/SiO2 hybrid bonding can be successfully fabricated under 200 °C by deploying highly <111>-oriented NT-Cu as bonding metal. To further study the reliability to the thermal fatigue, TCT and HTS conducted. According to JEDEC test standard, all sample passed by within \textasciitilde{}7\% of resistance increment.",

keywords = "Fine-pitch Cu/SiOhybrid bonding, High thermal fatigue, Reliability analysis, low contact resistivity, low temperature bonding",

author = "Ong, \{Jia Juen\} and Chiu, \{Wei Lan\} and Chang, \{Hsiang Hung\} and Tran, \{Dinh Phuc\} and Chih Chen",

note = "Publisher Copyright: {\textcopyright} 2023 Japan Institute of Electronics Packaging.; 22nd International Conference on Electronics Packaging, ICEP 2023 ; Conference date: 19-04-2023 Through 22-04-2023",

year = "2023",

doi = "10.23919/ICEP58572.2023.10129702",

language = "English",

series = "2023 International Conference on Electronics Packaging, ICEP 2023",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "15--16",

booktitle = "2023 International Conference on Electronics Packaging, ICEP 2023",

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Ong, JJ, Chiu, WL, Chang, HH, Tran, DP & Chen, C 2023, Fine-pitch <111>-oriented NT-Cu/SiO₂hybrid joints with high thermal fatigue resistance and low contact resistivity. in 2023 International Conference on Electronics Packaging, ICEP 2023. 2023 International Conference on Electronics Packaging, ICEP 2023, Institute of Electrical and Electronics Engineers Inc., pp. 15-16, 22nd International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19/04/23. https://doi.org/10.23919/ICEP58572.2023.10129702

Fine-pitch <111>-oriented NT-Cu/SiO₂hybrid joints with high thermal fatigue resistance and low contact resistivity. / Ong, Jia Juen; Chiu, Wei Lan; Chang, Hsiang Hung et al.
2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 15-16 (2023 International Conference on Electronics Packaging, ICEP 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Tran, Dinh Phuc

AU - Chen, Chih

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AB - Fine-pitched NT-Cu/SiO2 hybrid bonding can be successfully fabricated under 200 °C by deploying highly <111>-oriented NT-Cu as bonding metal. To further study the reliability to the thermal fatigue, TCT and HTS conducted. According to JEDEC test standard, all sample passed by within ~7% of resistance increment.

KW - Fine-pitch Cu/SiOhybrid bonding

KW - High thermal fatigue

KW - Reliability analysis

KW - low contact resistivity

KW - low temperature bonding

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Ong JJ, Chiu WL, Chang HH, Tran DP, Chen C. Fine-pitch <111>-oriented NT-Cu/SiO₂hybrid joints with high thermal fatigue resistance and low contact resistivity. In 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 15-16. (2023 International Conference on Electronics Packaging, ICEP 2023). doi: 10.23919/ICEP58572.2023.10129702