@inproceedings{06cd12b026be43c79a4ea707bf28b193,
title = "Fine-pitch <111>-oriented NT-Cu/SiO2hybrid joints with high thermal fatigue resistance and low contact resistivity",
abstract = "Fine-pitched NT-Cu/SiO2 hybrid bonding can be successfully fabricated under 200 °C by deploying highly <111>-oriented NT-Cu as bonding metal. To further study the reliability to the thermal fatigue, TCT and HTS conducted. According to JEDEC test standard, all sample passed by within ~7% of resistance increment.",
keywords = "Fine-pitch Cu/SiOhybrid bonding, High thermal fatigue, low contact resistivity, low temperature bonding, Reliability analysis",
author = "Ong, {Jia Juen} and Chiu, {Wei Lan} and Chang, {Hsiang Hung} and Tran, {Dinh Phuc} and Chih Chen",
note = "Publisher Copyright: {\textcopyright} 2023 Japan Institute of Electronics Packaging.; 22nd International Conference on Electronics Packaging, ICEP 2023 ; Conference date: 19-04-2023 Through 22-04-2023",
year = "2023",
doi = "10.23919/ICEP58572.2023.10129702",
language = "English",
series = "2023 International Conference on Electronics Packaging, ICEP 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "15--16",
booktitle = "2023 International Conference on Electronics Packaging, ICEP 2023",
address = "United States",
}