Fine-pitch <111>-oriented NT-Cu/SiO2hybrid joints with high thermal fatigue resistance and low contact resistivity

Jia Juen Ong, Wei Lan Chiu, Hsiang Hung Chang, Dinh Phuc Tran, Chih Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Fine-pitched NT-Cu/SiO2 hybrid bonding can be successfully fabricated under 200 °C by deploying highly <111>-oriented NT-Cu as bonding metal. To further study the reliability to the thermal fatigue, TCT and HTS conducted. According to JEDEC test standard, all sample passed by within ~7% of resistance increment.

Original languageEnglish
Title of host publication2023 International Conference on Electronics Packaging, ICEP 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages15-16
Number of pages2
ISBN (Electronic)9784991191152
DOIs
StatePublished - 2023
Event22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan
Duration: 19 Apr 202322 Apr 2023

Publication series

Name2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference22nd International Conference on Electronics Packaging, ICEP 2023
Country/TerritoryJapan
CityKumamoto
Period19/04/2322/04/23

Keywords

  • Fine-pitch Cu/SiOhybrid bonding
  • High thermal fatigue
  • low contact resistivity
  • low temperature bonding
  • Reliability analysis

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