Fine-Feature Cu/In Interconnect Bonding Using Single Sided Heating and Chip-to-Wafer Bonding Technology

Shih Wei Lee, Ching Yun Chang, Geng Ming Chang, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

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Engineering & Materials Science

Chemical Compounds

Medicine & Life Sciences