Ferroelectric, small bandgap and wide bandgap materials for ultra-low power green electronic devices

Albert Chin, Cheng W. Shih, Kai Zhi Kan, Tim Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

The power consumption in electronic devices is the major challenge as increasing the demand of IC chips. To lower the VDD and AC power (PAC), both high mobility material and steep turn-on device technology are useful. The ferroelectric high-κ HfZrO MOSFET can realize not only a small sub-threshold slope (SS) <60 mV/dec for low VDD and PAC, but also a smaller aspect ratio FinFET. The small bandgap (EG) Ge pMOSFET can lower the PAC by 4 times due to its 2× higher field-effective mobility at half effective field. The high-mobility wide EG GaN MOSFET is a candidate to lower the direct tunneling leakage current and DC power (PDC) by orders of magnitude in future deep X-nm device. The ferroelectric high-κ HfZrO MOSFET can also perform DRAM function with lower PDC than existing DRAM.

Original languageEnglish
Title of host publication2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings
EditorsYu-Long Jiang, Ting-Ao Tang, Ru Huang
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages14-17
Number of pages4
ISBN (Electronic)9781467397179
DOIs
StatePublished - 2016
Event13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Hangzhou, China
Duration: 25 Oct 201628 Oct 2016

Publication series

Name2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings

Conference

Conference13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016
Country/TerritoryChina
CityHangzhou
Period25/10/1628/10/16

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