Failure analysis for electronic devices on flexible substrate

Shih Ting Liu*, Tao Chi Liu, Ming Lun Chang, King Ting Chiang, Su Ping Chiu, Jandel Lin, Po Yuan Lo, Pei-Wen Li

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    2 Scopus citations

    Abstract

    Since organic materials are easily damaged, failure analysis of electronic devices on flexible substrate using practice FA techniques is hard to procure. However, worse uniformity of organic thin film and high driving voltage may result in failures seldom discovered in conventional Si-based device. This paper aims to analyze the failures of organic thin-film transistors (OTFTs) by the techniques established in this study, involving non-destructive detection, and electrical failure localization. Results of this study showed that the existence of voids in the dielectric not only caused abnormality of electrical features, but also resulted in violent failure with high driving voltage punching. We successfully demonstrated the failure induced by high driving voltage, particular elongation of gate metal, using TEM observation. To conclude, analysis of electrical failure for flexible devices is the main object. This research is a great enhancement in failure analysis of devices and packages comprising organics and flexible substrate.

    Original languageEnglish
    Title of host publicationIMPACT Conference 2009 International 3D IC Conference - Proceedings
    Pages392-394
    Number of pages3
    DOIs
    StatePublished - 1 Dec 2009
    EventIMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
    Duration: 21 Oct 200923 Oct 2009

    Publication series

    NameIMPACT Conference 2009 International 3D IC Conference - Proceedings

    Conference

    ConferenceIMPACT Conference 2009 International 3D IC Conference
    Country/TerritoryTaiwan
    CityTaipei
    Period21/10/0923/10/09

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