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Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2Hybrid Bonding
Shih Chi Yang*, Jia Juen Ong, Dinh Phuc Tran, Wei Lan Chiu, Ou Hsing Lee, Chia Wen Chiang, Hsiang Hung Chang, Chin Hung Wang, Chih Chen
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1
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citations