Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2Hybrid Bonding

Shih Chi Yang*, Jia Juen Ong, Dinh Phuc Tran, Wei Lan Chiu, Ou Hsing Lee, Chia Wen Chiang, Hsiang Hung Chang, Chin Hung Wang, Chih Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Nanotwinned Cu (NT-Cu) with highly (111)-oriented surface is beneficial to achieve low temperature Cu-Cu bonding. Nonetheless, it is difficult to deposit NT-Cu in Cu/SiO2 in small damascene vias. To overcome the restrict of the sidewall effect that may reduce surface (111) ratio of the vias, an optimized electrodeposition (ECD) approach was carried out. By tuning the electroplating temperatures and waveforms, we can successfully deposit NT-Cu into fine-pitch Cu/SiO2 vias. A bottom-up growing mode of NT-Cu can effectively reduce sidewall effect. Surface (111) ratio exceeds 80% and 55% for 8-μm and 2-μm Cu/SiO2 vias in diameter, respectively. Moreover, a theoretical model of predicting (111) ratio in small Cu/SiO2 vias based on the optimized ECD approach was proposed.

Original languageEnglish
Title of host publication2023 International Conference on Electronics Packaging, ICEP 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages13-14
Number of pages2
ISBN (Electronic)9784991191152
DOIs
StatePublished - 2023
Event22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan
Duration: 19 Apr 202322 Apr 2023

Publication series

Name2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference22nd International Conference on Electronics Packaging, ICEP 2023
Country/TerritoryJapan
CityKumamoto
Period19/04/2322/04/23

Keywords

  • Cu hybrid bonding
  • Cu/SiOdamascene process
  • Highly (111)-oriented nanotwinned Cu
  • three-dimensional integrated circuit
  • ultra-fine pitch packaging technology

Fingerprint

Dive into the research topics of 'Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2Hybrid Bonding'. Together they form a unique fingerprint.

Cite this