Evaluation on ESD robustness of LTPS diode and TFT device by Transmission Line Pulsing (TLP) technique

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    Abstract

    ESD robustness of Low Temperature Poly-Si (LTPS) diodes and TFT devices has been investigated in this paper. By using the Transmission Line Pulsing (TLP) techniques, the lt2 (secondary breakdown current) of LTPS diodes and TFT devices were measured. To evaluate the ESD robustness of components for ESD protection, the shifts of breakdown voltage and cut-in voltage of LTPS diode and TFT devices after TLP stress are considered into failure threshold judgment. From the experimental results, It2 of LTPS diodes under forward-biased stress is better than that of LTPS TFT devices. Furthermore, the It2 of LTPS TFT devices under reversebiased stress is more robust than it under forward-biased stress. Such investigation results can help us to design a successful ESD protection for the circuits on glass.

    Original languageEnglish
    Title of host publicationVLSI 2003 - 2003 20th International Symposium on VLSI Technology, Systems and Applications, Proceedings
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages88-91
    Number of pages4
    ISBN (Electronic)0780377656
    DOIs
    StatePublished - 1 Jan 2003
    Event20th International Symposium on VLSI Technology, Systems and Applications, VLSI 2003 - Hsinchu, Taiwan
    Duration: 6 Oct 20038 Oct 2003

    Publication series

    NameInternational Symposium on VLSI Technology, Systems, and Applications, Proceedings
    Volume2003-January
    ISSN (Print)1930-8868

    Conference

    Conference20th International Symposium on VLSI Technology, Systems and Applications, VLSI 2003
    Country/TerritoryTaiwan
    CityHsinchu
    Period6/10/038/10/03

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