Enhancement of Low-Temperature Cu-Cu Bonding by Metal Alloy Passivation in Ambient Atmosphere

Mu Ping Hsu, Chih Han Chen, Zhong Jie Hong, Tai Yu Lin, Ying Chan Hung, Kuan Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

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Engineering

Material Science