Abstract
A new manufacturing method for Ni-metal-induced lateral crystallization thin film transistors (NILCTFTs) using fluorine-silicate-glass (FSG) was proposed. In FSG-TFTs, fluorine ion was implanted into the buffer oxide layer to form FSG before NILC processes. It was found FSG-TFTs exhibit high field-effect mobility, low threshold voltage, low subthreshold slope, high ON/OFF current ratio, low trap state density, low interface trap state density, and good reliability compared with typical NILC-TFTs.
Original language | English |
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Pages (from-to) | 637-640 |
Number of pages | 4 |
Journal | Materials Chemistry and Physics |
Volume | 132 |
Issue number | 2-3 |
DOIs | |
State | Published - 15 Feb 2012 |
Keywords
- (NILC)
- (poly-Si TFTs)
- Fluorinated-silicate-glass (FSG)
- Ni-metal-induced lateral crystallization
- Polycrystalline silicon thin-film transistors