Abstract
An InGaN-GaN light-emitting diodes (LEDs) with double roughened (p-GaN and undoped-GaN) surfaces were successfully fabricated by surface-roughening, wafer-bonding and laser lift-off technologies. The effect of the roughness of the undoped-GaN layer on the performance of double roughened LEDs was investigated. It was found that the rms roughness of the undoped-GaN layer increased from 18.6 to 146.7 nm, the output power increased from 7.2 to 10.2 mW, and view angle decreased from 133.6 to 116°.
Original language | English |
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Pages (from-to) | 7709-7712 |
Number of pages | 4 |
Journal | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers |
Volume | 45 |
Issue number | 10 A |
DOIs | |
State | Published - 15 Oct 2006 |
Keywords
- InGaN-GaN light-emitting diodes
- Laser lift-off technology
- Surface-roughening
- Wafer-bonding