TY - GEN
T1 - Electromigration and Temperature Cycling Tests of Cu-Cu Joints Fabricated by Instant Copper Direct Bonding
AU - Shie, Kai Cheng
AU - Hsu, Po Ning
AU - Li, Yu Jin
AU - Tu, K. N.
AU - Lin, Benson Tzu Hung
AU - Chang, Chia Cheng
AU - Chen, Chih
N1 - Publisher Copyright:
© 2021 IEEE
PY - 2021
Y1 - 2021
N2 - Because Cu-Cu bonding is the key technique in 3D IC packaging, its reliabilities will become issues in the future. In this study, Cu-Cu joints with underfill was fabricated by using instant bonding process, in which bonding conditions were under 31~90 MPa at 300 ℃ for 10~30 s. Several samples underwent two reliability tests: temperature cycling test (TCT) and electromigration (EM) test. These samples passed 1000 cycles TCT, and the measured EM life time was least 3 times longer than that of solder joints with similar dimension. Failure mechanisms of reliability tests were examined by cross-section images and finite element analysis. In TCT, cracks were formed at bonding interface because it is relative weak compared to the neighboring structures. For EM tests, voids were formed at passivation opening of joints with current crowding. The current study provides a fundamental understanding in the reliabilities of Cu/organic dielectric hybrid bonding structures.
AB - Because Cu-Cu bonding is the key technique in 3D IC packaging, its reliabilities will become issues in the future. In this study, Cu-Cu joints with underfill was fabricated by using instant bonding process, in which bonding conditions were under 31~90 MPa at 300 ℃ for 10~30 s. Several samples underwent two reliability tests: temperature cycling test (TCT) and electromigration (EM) test. These samples passed 1000 cycles TCT, and the measured EM life time was least 3 times longer than that of solder joints with similar dimension. Failure mechanisms of reliability tests were examined by cross-section images and finite element analysis. In TCT, cracks were formed at bonding interface because it is relative weak compared to the neighboring structures. For EM tests, voids were formed at passivation opening of joints with current crowding. The current study provides a fundamental understanding in the reliabilities of Cu/organic dielectric hybrid bonding structures.
KW - Chip-to-chip bonding
KW - Cu direct bonding
KW - Electromigration
KW - Hybrid bonding structure
KW - Temperature cycling test
UR - https://www.scopus.com/pages/publications/85115724895
U2 - 10.1109/ECTC32696.2021.00163
DO - 10.1109/ECTC32696.2021.00163
M3 - Conference contribution
AN - SCOPUS:85115724895
T3 - Proceedings - Electronic Components and Technology Conference
SP - 995
EP - 1000
BT - Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 71st IEEE Electronic Components and Technology Conference, ECTC 2021
Y2 - 1 June 2021 through 4 July 2021
ER -