| Original language | English |
|---|---|
| Patent number | US 8,546,952 B2 |
| State | Published - 1 Oct 2013 |
ELECTRICAL TEST STRUCTURE APPLYING 3D-ICS BONDING TECHNOLOGY FOR STACKING ERROR MEASUREMENT
Kuan-Neng Chen (Inventor)
Research output: Patent
Kuan-Neng Chen (Inventor)
Research output: Patent
| Original language | English |
|---|---|
| Patent number | US 8,546,952 B2 |
| State | Published - 1 Oct 2013 |