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Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon Via
Yi Chieh Tsai, Chia Hsuan Lee, Hsin Chi Chang, Jui Han Liu, Han Wen Hu, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, Kuan-Neng Chen
Research output: Contribution to journal › Article › peer-review
12
Scopus
citations