Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon Via

  • Yi Chieh Tsai
  • , Chia Hsuan Lee
  • , Hsin Chi Chang
  • , Jui Han Liu
  • , Han Wen Hu
  • , Hiroyuki Ito
  • , Young Suk Kim
  • , Takayuki Ohba
  • , Kuan-Neng Chen

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

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Keyphrases

Engineering

Material Science