Abstract
The effects of poly-Si gate doping type and species as well as thermal treatments on negative-bias-temperature instability (NBTI) of p-channel metal-oxide-semiconductor field effect transistors (MOSFETs) were investigated. We found that devices with n+-poly-Si gate depict a smaller threshold voltage shift after bias-temperature stressing, compared to their p+-poly-Si-gated counterparts. By carefully controlling the thermal budget to suppress boron penetration, NBTI can be reduced by fluorine incorporation in p+-poly-Si-gated devices. Finally, NBTI is found to be aggravated in devices subjected to H2 postmetalannealing, highlighting the important role of hydrogen bonds.
Original language | English |
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Pages (from-to) | G144-G148 |
Journal | Journal of the Electrochemical Society |
Volume | 151 |
Issue number | 2 |
DOIs | |
State | Published - 2004 |